1. General characteristics:Application: this specification is applied micro switch used for general application Operating temperature range: -25 - 65°C Operating relative humidity: ≤85% RH Test conditions: unless otherwise specified, the atmospheric conditions for making measurements and tests are as follows: Environment temperature: 5-35°C Atmospheric pressure: 86 - 106kPa (860 - 1060mbar) Contact resistance: 1Ω max Insulation resistance: 50MΩ minSolder ability:More than 80% of immersed part shall be covered with solder Switch shall be tested according to the following request: (1) Equipment: auto-dip chamber (2) Solder: normal (3) Flux: rosin flux having a nominal composition of 25% solids by mA of white rosin in methyl alcohol solution (4) Soldering temperature: 230 ±5°C (5) Immersing time: 3 ±0.5s (6) Immersion depth: immersion depth shall be at copper plating portion of PCB after mounting (thickness of PCB=1.6mm)
1. General characteristics:Application: this specification is applied micro switch used for general application Operating temperature range: -25 - 65°C Operating relative humidity: ≤85% RH Test conditions: unless otherwise specified, the atmospheric conditions for making measurements and tests are as follows: Environment temperature: 5-35°C Atmospheric pressure: 86 - 106kPa (860 - 1060mbar) Contact resistance: 1Ω max Insulation resistance: 50MΩ minSolder ability:More than 80% of immersed part shall be covered with solder Switch shall be tested according to the following request: (1) Equipment: auto-dip chamber (2) Solder: normal (3) Flux: rosin flux having a nominal composition of 25% solids by mA of white rosin in methyl alcohol solution (4) Soldering temperature: 230 ±5°C (5) Immersing time: 3 ±0.5s (6) Immersion depth: immersion depth shall be at copper plating portion of PCB after mounting (thickness of PCB=1.6mm)
