Product Information
Key Specifications/ Special Features
Features: Multiple layers (4-layer, 6-layer, 8-layer and above), high density, used for complex electronic products.
Application fields: Automotive / Communication Equipment / Power Supply / High-end Industrial Control
High-end power multi-layer boards: 16-layer automotive power module boards, high-power inverter multi-layer thick copper boards
Surface treatment: Immersion gold (ENIG), chemical tin (TIN) treatment, suitable for high-precision soldering
Features: Multiple layers (4-layer, 6-layer, 8-layer and above), high density, used for complex electronic products.
Application fields: Automotive / Communication Equipment / Power Supply / High-end Industrial Control
High-end power multi-layer boards: 16-layer automotive power module boards, high-power inverter multi-layer thick copper boards
Surface treatment: Immersion gold (ENIG), chemical tin (TIN) treatment, suitable for high-precision soldering
